| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an adhesive film that is used for a multilayer printed wiring board by the build-up method, forms a conductor layer having high adhesive strength even if being an interlayer insulating layer having a smooth surface-roughened state and is hardly roughened by a desmearing treatment; a multilayer printed wiring board using the adhesive film; and a method for producing the multilayer printed wiring board. <P>SOLUTION: The adhesive film includes: a layer A comprising a resin composition containing components (a)-(d) blended in the following blending quantities, a layer B comprising a thermosetting resin composition that is solid at <40°C and melts at≥40°C and <140°C and a layer C that is a substrate for supporting the layer A and these layers are arranged in the order of the layer C, the layer A and the layer B. The component (a) is a resin to be dissolved in an organic solvent and one or more resins selected from a polyimide resin, polyamide-imide resin, polyamide resin, polyether imide resin and polybenzoxazole resin, the component (b) is a thermosetting resin, the component (c) is a filler and the component (d) is a resin having a polysiloxane skeleton. The ratio of the mass of the component (a) to the mass of the component (b) is 1:2 to 1:20, the ratio of the total mass of the component (a) and the component (b) to the mass of the component (c) is 20:1 to 2:1, the ratio of the mass of the component (d) to the mass of the component (a) is 1:1,000 to 2:5 and the total blending quantity of the component (a) to the component (d) is≥70 pts.mass based on 100 pts.mass of the resin composition. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
