| 发明名称 | Semiconductor stacked package | ||
| 摘要 | A semiconductor stacked package may include a substrate formed with a plurality of coupling pads, a plurality of semiconductor chips stacked on the substrate. The semiconductor stacked package may also include first circuit units disposed on each of the semiconductor chips, and electrically connected with the coupling pads by the medium of bonding pads. The semiconductor stacked package may include second circuit units disposed on each of the semiconductor chips and electrically disconnected with the coupling pads, connection pads disposed on each of the semiconductor chips and corresponding to the second circuit units, and blocking circuits coupled between the second circuit units and the connection pads. The semiconductor stacked package may also include bonding wires electrically connecting the bonding pads and the coupling pads. | ||
| 申请公布号 | US9208827(B2) | 申请公布日期 | 2015.12.08 |
| 申请号 | US201414526802 | 申请日期 | 2014.10.29 |
| 申请人 | SK Hynix Inc. | 发明人 | Lee Ki Yong;Kim Jong Hyun;Kim Sang Hwan |
| 分类号 | H01L23/48;H01L23/52;H01L29/40;H01L23/02;G11C5/02;H01L25/065;H01L23/00;G11C7/14;H01L23/525;G11C7/10;G11C5/14;G11C29/12 | 主分类号 | H01L23/48 |
| 代理机构 | William Park & Associates Ltd. | 代理人 | William Park & Associates Ltd. |
| 主权项 | 1. A semiconductor stacked package comprising: a substrate formed with a plurality of coupling pads; a plurality of semiconductor chips stacked on the substrate; first circuit units disposed on each of the semiconductor chips, and electrically connected with the coupling pads by the medium of bonding pads; second circuit units disposed on each of the semiconductor chips and electrically disconnected with the coupling pads; connection pads disposed on each of the semiconductor chips and corresponding to the second circuit units; blocking circuits coupled between the second circuit units and the connection pads; and bonding wires electrically connecting the bonding pads and the coupling pads. | ||
| 地址 | Gyeonggi-do KR | ||