发明名称 |
DAMAGE DETECTING APPARATUS OF BONDING STRUCTURE |
摘要 |
The present invention relates to a nondestructive damage detector for a damage detection of a bonded structure and, more particularly, to an adhesive engaging portion damage detector which adheres a structure using an adhesive comprising a conductive material, and measures an electrical physical quantity of a bonded structure, thereby enables to detect an internal defect of the bonded structure. |
申请公布号 |
KR20150136807(A) |
申请公布日期 |
2015.12.08 |
申请号 |
KR20140064287 |
申请日期 |
2014.05.28 |
申请人 |
INDUSTRY-ACADEMIC COOPERATION FOUNDATION GYEONGSANG NATIONAL UNIVERSITY |
发明人 |
CHOI, JIN HO;KWEON, JIN HWE |
分类号 |
G01N27/20;G01R27/00 |
主分类号 |
G01N27/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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