STACKED PACKAGE AND METHOD FOR MANUFACTURING THE SAME

摘要

The present invention relates to a stacked package, and a manufacturing method thereof. The manufacturing method of the stacked package according to the present invention comprises the following processes: (a) mounting a lower package having a first semiconductor chip and a first molding unit on a first substrate having a first wire pattern and a connection terminal, and mounting an upper package having a second semiconductor chip and a second molding unit on a second substrate having a second wire pattern, respectively; (b) forming a via hole by removing the first molding unit such that the upper surface of the connection terminal of the lower package is exposed; (c) filling solder balls in the via hole; and (d) stacking the lower package on the upper package such that the top solder ball and the second wire pattern are electrically connected to each other.