| 摘要 |
PROBLEM TO BE SOLVED: To provide a discharge amount adjustment method which allows for reduction of burden on a worker in a work for adjusting the discharge amount pf a pump, and to provide a coating processor and a recording medium.SOLUTION: A discharge amount adjustment method uses a coating processor configured to coat a wafer with liquid and including a rotation holding section for rotating a wafer while holding, a pump having a barrier displacing by the fluid pressure and pressure feeding the liquid, and a nozzle for discharging the liquid pressure fed by the barrier onto the wafer. The discharge amount adjustment method includes steps for controlling the pump to discharge liquid from the nozzle onto the wafer, detecting the displacement amount of the barrier incident to pressure feed of the liquid, adjusting the discharge amount of liquid from the nozzle based on the detection results of the displacement amount of the barrier, and controlling the rotation holding section so as to rotate the wafer at a number of revolutions for shaking off the discharged liquid for adjustment of the displacement amount. |
