| 发明名称 |
METHOD OF PRODUCING A REMOVABLE WAFER CONNECTION AND CARRIER FOR WAFER SUPPORT |
| 摘要 |
A relief structure is formed on a surface of a carrier provided for accommodating a wafer, which is fastened to the carrier by a removable adhesive contacting the carrier. The relief structure, which may be spatially confined to the centre of the carrier, reduces the strength of adhesion between the wafer and the carrier. If the adhesive is appropriately selected and maintains the connection between the wafer and the carrier at elevated temperatures, further process steps can be performed at temperatures of typically 300° C. or more. The subsequent mechanical separation of the adhesive joint is facilitated by the relief structure on the carrier. |
| 申请公布号 |
US2015348817(A1) |
申请公布日期 |
2015.12.03 |
| 申请号 |
US201314654471 |
申请日期 |
2013.12.19 |
| 申请人 |
AMS AG |
发明人 |
BODNER Thomas;SIEGERT Joerg;SCHREMS Martin |
| 分类号 |
H01L21/683 |
主分类号 |
H01L21/683 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of producing a removable wafer connection, comprising:
providing a wafer and a carrier having a surface provided for accommodating the wafer; fastening the wafer to the carrier by a removable adhesive contacting the carrier; and providing the surface of the carrier with a relief structure, before the adhesive is brought into contact with the surface of the carrier, the relief structure reducing the strength of adhesion between the wafer and the carrier. |
| 地址 |
Unterpremstätten AT |
