发明名称 CASE-MOLD-TYPE CAPACITOR AND METHOD FOR PRODUCING SAME
摘要 A case-mold-type capacitor includes a capacitor element, first and second bus bars connected to the first and second electrodes of the capacitor element, a case accommodating the capacitor element and the first and second bus bars, and a mold resin filling the case therein. The case has a cutaway portion provided therein. A sealing plate joined to the case so as to seal the cutaway portion. The first and second bus bars pass through the sealing plate and are fixed to the sealing plate. The case-mold-type capacitor improves dimensional accuracy between terminal portions of the first and second bus bars without increasing material cost, and has high reliability.
申请公布号 US2015348710(A1) 申请公布日期 2015.12.03
申请号 US201314648662 申请日期 2013.11.27
申请人 Panasonic Intellectual Property Management Co., Ltd. 发明人 SATO Shinya;MIURA Toshihisa
分类号 H01G4/236;H01G4/005;H01G4/224;H01G4/06 主分类号 H01G4/236
代理机构 代理人
主权项 1. A case-mold-type capacitor comprising: a capacitor element including a capacitor element body, a first electrode provided on the capacitor element body, and a second electrode provided on the capacitor element body; a first bus bar including a first connection portion and a first terminal portion for external connection, the first connection portion being connected to the first electrode of the capacitor element, the first terminal portion being connected to the first connection portion; a second bus bar including a second connection portion and a second terminal portion for external connection, the second connection portion being connected to the second electrode of the capacitor element, the second terminal portion being connected to the second connection portion; a case accommodating the capacitor element, the first connection portion of the first bus bar, and the second connection portion of the second bus bar therein, the case having a side wall which has a cutaway portion provided therein; a sealing plate joined to the case so as to seal the cutaway portion; and a mold resin filling the case so as to cover the capacitor element, the first connection portion of the first bus bar, and the second connection portion of the second bus bar, wherein the first bus bar and the second bus bar passes through the sealing plate and are fixed to the sealing plate such that the first terminal portion of the first bus bar and the second terminal portion of the second bus bar are exposed to outside of the case.
地址 Osaka JP