SOLID-STATE IMAGING DEVICE, MEMBERS FOR THE SAME, AND IMAGING SYSTEM

摘要

The present invention provides a solid-state imaging device including a pad capable of reducing inferior connection with an external terminal. The solid-state imaging device includes a first substrate provided, on its front face, with photoelectric conversion elements, a first wiring structure, a second substrate provided, on its front face, with at least a part of peripheral circuits, and a second wiring structure. The first substrate, the first wiring structure, the second wiring structure, and the second substrate are provided in this order. The first wiring structure includes a wiring layer including wirings made mainly of copper. The second wiring structure includes a wiring layer including wirings made mainly of copper. Wirings made mainly of copper in the first wiring structure are bonded with wirings made mainly of copper in the second wiring structure. The solid-state imaging device includes a pad formed of a conductive element made mainly of aluminum.

主权项

1. A solid-state imaging device comprising:
a first substrate provided with photoelectric conversion elements on its front face; a first wiring structure provided on the front face of the first substrate; a second substrate provided, on its front face, with at least a part of peripheral circuits including read-out circuits and control circuits for reading a signal generated based on electric charges of the photoelectric conversion elements; and a second wiring structure provided on the front face of the second substrate, wherein the first substrate, the first wiring structure, the second wiring structure, and the second substrate are provided in this order, wherein the first wiring structure includes a wiring layer including wirings made mainly of copper, wherein the second wiring structure includes a wiring layer including wirings made mainly of copper, wherein wirings made mainly of copper in the wiring layer in the first wiring structure are bonded with wirings made mainly of copper in the wiring layer in the second wiring structure, and wherein the solid-state imaging device include a pad for outputting a signal based on electric charges of the photoelectric conversion elements formed of a conductive element made mainly of aluminum.