| 摘要 |
PROBLEM TO BE SOLVED: To provide a beam lead in which a stress inputted to the junction of a beam lead can be reduced, when the temperature of a beam lead changes, and to provide a semiconductor device and a method of manufacturing a semiconductor device.SOLUTION: A beam lead 11 is connected with a semiconductor chip 7 disposed on a substrate 3, and consists of a flexible mesh or braid. Since the beam lead 11 is flexible, it has rigidity lower than that of a conventional metal. Consequently, even if the shape of the beam lead 11 changes due to temperature change, a stress inputted to the junction of the beam lead 11 and semiconductor chip 7 is reduced. Impairment of the beam lead 11 and semiconductor chip 7 is thereby suppressed effectively. |
