| 发明名称 |
SUBSTRATE TREATING APPARATUS AND METHOD |
| 摘要 |
The inventive concepts provide an apparatus for treating a substrate. The apparatus includes a housing having a treatment space therein, a support unit supporting the substrate in the treatment space, a nozzle unit discharging a solution onto the substrate supported by the support unit, and a solution supply unit supplying the solution to the nozzle unit. The solution supply unit includes a solution supply line connected to the nozzle unit, a heating member installed on the solution supply line to heat the solution, and a recovery line diverging from the solution supply line at a first point disposed downstream from the heating member. |
| 申请公布号 |
US2015348805(A1) |
申请公布日期 |
2015.12.03 |
| 申请号 |
US201514716996 |
申请日期 |
2015.05.20 |
| 申请人 |
Semes Co., Ltd. |
发明人 |
KIM Bong Joo;LEE Seung Ho;CHOI Yong-Hyoun;KANG Byung-Man |
| 分类号 |
H01L21/67;H01L21/3213;H01L21/311 |
主分类号 |
H01L21/67 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An apparatus for treating a substrate, the apparatus comprising:
a treatment container having a treatment space therein; a support unit supporting the substrate in the treatment space; a nozzle unit discharging a solution onto the substrate supported by the support unit; and a solution supply unit supplying the solution to the nozzle unit, wherein the solution supply unit comprises: a solution supply line connected to the nozzle unit; a heating member installed on the solution supply line to heat the solution; and a recovery line diverging from the solution supply line at a first point disposed downstream from the heating member. |
| 地址 |
Cheonan-si KR |
