发明名称 APPARATUS FOR PROCESSING CUTTING PART OF GLASS SUBSTRATE
摘要 The present invention relates to an apparatus to process a cutting part of a glass substrate comprising: a heating member; a supporter of the heating member; and a supporter of a glass substrate. The apparatus to process the cutting part of a glass substrate is configured to be able to move comprising: at least one of a supporter of the heating member and the supporter of the glass substrate may sequentially be in contact with a cut part of the glass substrate fixated to the supporters of the heating member and the glass substrate; the heating member includes a contact part in two directions or a contact part in three directions in contact with the cut part of the glass substrate; the contact part in two directions connected to form an interior angle of a contact surface in each direction greater than 10 degrees but less than 180 degrees; the contact part in three directions includes one vertical contact surface and two edge contact surfaces in contact with a vertical surface of the cut part of the glass substrate; and an edge contact surface connected to form an interior angle greater than 90 degrees but less than 180 degrees on both ends of the vertical contact surface.
申请公布号 KR20150133070(A) 申请公布日期 2015.11.27
申请号 KR20140059927 申请日期 2014.05.19
申请人 DONGWOO FINE-CHEM CO., LTD. 发明人 SON, DONG JIN;KIM, DONG HWAN;KIM, JONG MIN;TAK, GWANG YONG
分类号 B26F3/08;C03B29/00;C03B33/08 主分类号 B26F3/08
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