发明名称 |
VAPOR CHAMBER AMPLIFIER MODULE |
摘要 |
In one embodiment, an electronic system includes a printed circuit board, one or more packaged semiconductor devices, and a vapor chamber having a top and a bottom and enclosing a sealed cavity that is partially filled with a coolant. The vapor chamber comprises a thermo-conductive and electro-conductive material. The top of the vapor chamber has one or more depressions formed therein, each depression receiving and thermo-conductively connected to at least part of a bottom of a corresponding packaged semiconductor device, which is mounted through a corresponding aperture in the PCB. A heat sink may be thermo-conductively attached to the bottom of the vapor chamber. |
申请公布号 |
WO2015179089(A1) |
申请公布日期 |
2015.11.26 |
申请号 |
WO2015US28237 |
申请日期 |
2015.04.29 |
申请人 |
COMMSCOPE TECHNOLOGIES LLC |
发明人 |
PATEL, SAMMIT, A.;XU, YONGJIE;GU, QIYUN;BROWN, RICHARD, W. |
分类号 |
H01L23/427;H05K7/20 |
主分类号 |
H01L23/427 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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