| 摘要 |
An LED chip (3) is disposed in a recessed portion (21p) formed by bending a metal lead frame (2). A reflector (4) has a resin reflection surface (4a) and the recessed portion (21p) has a metal reflection surface (21a). When the inclination angle of at least one metal reflection surface (21a) is θs2(°), the resin reflection surface (4a) has a sloped resin surface with an inclination angle of θs1(°) that is smaller than θs2(°). With θc(°) defined as the critical angle of light emitted from an LED chip (3) and incident on the interface between a light-transmissive resin (5) and an air layer, the sloped resin surface and metal reflection surface having a relationship of θs1<θs2, satisfies both a conditional expression (1): 45°−θc/2<θs1<θc and a conditional expression (2): 35°≦θs2≦55°. |
