VIA FOR ELECTRICAL CONTACT PASSING THROUGH LAYERS OF OPTICAL WAVEGUIDE IN MULTILAYER STRUCTURE INCLUDING ELECTRICAL SUBSTRATE AND LAMINATED LAYERS OF OPTICAL WAVEGUIDE

摘要

A structure is formed which is prepared as a via for electrical contact passing through layers of an optical waveguide, in a multilayer structure including an electrical substrate and the laminated layers of the optical waveguide. The surface of an electrode pad is plated with solder. The layers of the optical waveguide are formed above the portion plated with solder are removed to expose the portion plated with solder. A device is prepared having both a light-emitter or photoreceptor in optical contact with the optical waveguide, and a stud (pillar). The stud (pillar) is inserted into the portion in which layers of the optical waveguide have been removed, and the plated solder is melted to bond the electrode pad on top of the electrical substrate to the tip of the inserted stud (pillar).

主权项

1. A method of forming a structure prepared as a via for electrical contact passing through layers of an optical waveguide in a multilayer structure including an electrical substrate and the laminated layers of the optical waveguide, the method comprising the steps of:
preparing a resist pattern above an electrode pad on top of the electrical substrate; plating the surface of the electrode pad with solder in accordance with the resist pattern; removing the prepared resist pattern; forming the layers of the optical waveguide on top of the electrical substrate, covering the portion plated with solder; and removing the layers of the optical waveguide above the portion plated with solder, exposing the portion plated with solder.