发明名称 Transmission Line RF Applicator for Plasma Chamber
摘要 A transmission line RF applicator apparatus and method for coupling RF power to a plasma in a plasma chamber. The apparatus comprises two conductors, one of which has a plurality of apertures. In one aspect, apertures in different portions of the conductor have different sizes, spacing or orientations. In another aspect, adjacent apertures at successive longitudinal positions are offset along the transverse dimension. In another aspect, the apparatus comprises an inner conductor and one or two outer conductors. The main portion of each of the one or two outer conductors includes a plurality of apertures that extend between an inner surface and an outer surface of the outer conductor.
申请公布号 US2015340204(A1) 申请公布日期 2015.11.26
申请号 US201514727857 申请日期 2015.06.01
申请人 Applied Materials, Inc. 发明人 Kudela Jozef;Tanaka Tsutomu;Sorensen Carl A.;Anwar Suhail;White John M.;Shinde Ranjit Indrajit;Cho Seon-Mee;Truong Douglas D.
分类号 H01J37/32 主分类号 H01J37/32
代理机构 代理人
主权项
地址 Santa Clara CA US