SEMICONDUCTOR DIE DETACHMENT APPARATUS AND DETACHMENT METHOD THEREOF

摘要

The present invention relates to a semiconductor die separating device and a separating method thereof, more specifically, to a semiconductor die separating device and a separating method thereof which sequentially operates first and second ejecting members after completely peeling a mounting tape of a circumference area of a semiconductor die through a roller unit to prevent defects such as pickup miss or die cracks in case of semiconductor die pickup.