发明名称 硬化性樹脂組成物、それを用いたドライフィルム及びプリント配線板
摘要 Disclosed is a curable resin composition that contains a resin containing carboxyl groups, titanium oxide, and a metal phosphinate, and preferably contains a thermosetting resin, so as to be able to achieve halogen-free flame resistance and make possible formation of a highly reflective white coating layer with superior resolution and low warpage. A carboxylic acid resin having a urethane skeleton is preferable for the resin containing carboxyl groups. Also disclosed is a printed wiring board formed by using this curable resin composition or a dry film thereof and on which a flame resistant film, such as a solder resist, is formed thereby.
申请公布号 JP5820568(B2) 申请公布日期 2015.11.24
申请号 JP20100082197 申请日期 2010.03.31
申请人 太陽ホールディングス株式会社 发明人 横山 裕;米田 一善;有馬 聖夫
分类号 C09D163/00;H05K3/28 主分类号 C09D163/00
代理机构 代理人
主权项
地址