发明名称 Light-emitting device and method for manufacturing the same
摘要 A highly reliable light-emitting device and a manufacturing method thereof are provided. A light-emitting element and a terminal electrode are formed over an element formation substrate; a first substrate having an opening is formed over the light-emitting element and the terminal electrode with a bonding layer provided therebetween; an embedded layer is formed in the opening; a transfer substrate is formed over the first substrate and the embedded layer; the element formation substrate is separated; a second substrate is formed under the light-emitting element and the terminal electrode; and the transfer substrate and the embedded layer are removed. In addition, an anisotropic conductive connection layer is formed in the opening, and an electrode is formed over the anisotropic conductive connection layer. The terminal electrode and the electrode are electrically connected to each other through the anisotropic conductive connection layer.
申请公布号 US9196813(B2) 申请公布日期 2015.11.24
申请号 US201514620425 申请日期 2015.02.12
申请人 Semiconductor Energy Laboratory Co., Ltd. 发明人 Chida Akihiro
分类号 H01L21/00;H01L33/62;H01L51/00;H01L51/52;H01L51/56;H01L27/12;H01L27/32;H01L33/20;H01L33/48 主分类号 H01L21/00
代理机构 Robinson Intellectual Property Law Office, P.C. 代理人 Robinson Eric J.;Robinson Intellectual Property Law Office, P.C.
主权项 1. A method for manufacturing a light-emitting device, comprising the steps of: forming a terminal electrode and a light-emitting element comprising an EL layer over a substrate, wherein a first layer comprising an organic compound contained in the EL layer is provided over the terminal electrode; forming a first substrate having a first opening over the light-emitting element and the terminal electrode with a bonding layer having a second opening interposed therebetween, wherein the terminal electrode, the first layer, the first opening, and the second opening are overlapped with each other; exposing a part of the terminal electrode by removing the first layer with an organic solvent; forming an anisotropic conductive connection layer in the first opening and the second opening; and forming an external electrode electrically connected to the terminal electrode through the anisotropic conductive connection layer.
地址 Atsugi-shi, Kanagawa-ken JP