| 摘要 |
<p>In a semiconductor device in which an IC unit and a coil antenna connected to said IC unit are formed on the same substrate, the coil antenna is formed by conductor layers (ANT1) and (ANT2) that are mutually different layers. An interlayer insulating film is interposed between the conductor layers (ANT1) and (ANT2). The conductor layers (ANT1) and (ANT2) have overlapping sections (OVL) overlapping via the interlayer insulating film in the direction orthogonal to the principal surface of a substrate, wherein the width of the conductor layers (ANT1) and (ANT2) at the overlapping sections (OVL) is smaller than the width of the other sections.</p> |
