发明名称 Millimeter-wave radio frequency integrated circuit packages with integrated antennas
摘要 A package structure includes a planar core structure, an antenna structure disposed on one side of the planar core structure, and an interface structure disposed on an opposite side of the planar core structure. The antenna structure and interface structure are each formed of a plurality of laminated layers, each laminated layer having a patterned conductive layer formed on an insulating layer. The antenna structure includes a planar antenna formed on one or more patterned conductive layers of the laminated layers. The interface structure includes a power plane, a ground plane, signal lines, and contact pads formed on one or more patterned conductive layers of the laminated layers of the interface structure. The package structure further includes an antenna feed line structure formed in, and routed through, the interface structure and the planar core structure, and connected to the planar antenna.
申请公布号 US9196951(B2) 申请公布日期 2015.11.24
申请号 US201213685262 申请日期 2012.11.26
申请人 International Business Machines Corporation 发明人 Baks Christian W.;Gu Xiaoxiong;Islam MD. Rashidul;Liu Duixian
分类号 H01Q1/38;H01Q1/22 主分类号 H01Q1/38
代理机构 Ryan, Mason & Lewis, LLP 代理人 Dougherty Anne V.;Ryan, Mason & Lewis, LLP
主权项 1. A package structure, comprising: a planar core structure comprising a first side and a second side opposite the first side, wherein the planar core structure comprises as core substrate formed of an insulating material; an antenna structure disposed on the first side of the planar core structure, the antenna structure comprising a plurality of laminated layers, each laminated layer comprising a patterned conductive layer formed on an insulating layer, wherein the antenna structure comprises a planar antenna formed on one or more patterned conductive layers of the laminated layers of the antenna structure; an interface structure disposed on the second side of the planar core structure, wherein the interface structure comprises a plurality of laminated layers, each laminated layer comprising a patterned conductive layer formed on an insulating layer, wherein the interface structure comprises a power plane, a ground plane, signal lines, and contact pads formed on one or more patterned conductive layers of the laminated layers of the interface structure; and an antenna feed line structure formed in, and routed through, the interface structure and the planar core structure, and connected to the planar antenna, wherein the insulating material forming the core substrate is different from an insulating material forming the insulating layers of the antenna structure and interface structure.
地址 Armonk NY US
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