| 摘要 |
PROBLEM TO BE SOLVED: To provide a non-cleaning type soldering flux which causes little change with time when a solder paste is formed by mixture with a solder alloy powder and enables the suppression of the generation of migration upon junction and the generation of flux residues.SOLUTION: A soldering flux is configured of a flux main component by 35-70 mass%, an acetylene alcohol compound by 1-15 mass%, and a phosphoric ester by 1-15 mass%. At this time, at least a kind selected from a group of rosin, modified rosin, abietic acid, and modified abietic acid with a softening point of 70-170°C and an acidic value of 100-200 mgKOH/g is used as the flux main component. |
