| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and a manufacturing method of the same, which can reduce labor hour and increase an integration degree.SOLUTION: A semiconductor device manufacturing method comprises: a process of forming a first insulation film on one side of a first substrate; a process of forming at least one first opening and a plurality of second openings; a process of mounting a first semiconductor chip on one surface of the first substrate and in the first opening; a process of supplying a plurality of first solder balls in the plurality of second openings; a process of fusing the plurality of first solder balls to form a plurality of first conductor parts in the plurality of second openings; and a process of mounting a plurality of second solder balls connected with the plurality of first conductor parts on the first insulation film to form a plurality of first external electrodes. |
