发明名称 ELECTRONIC COMPONENT MOUNTING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an electronic component mounting device that can surely take out components without reducing the productivity of component mounting.SOLUTION: When a suction nozzle 5 provided to a rotor 6B of a mounting head 6 is positioned above a housing part 50 for an electronic component D, an image of the housing part 50 is picked up by an imaging camera 20 provided to a head fixing body 6A at the outside of the rotor 6B, and a positional displacement from a component take-out position is recognized. Thereafter, the mounting head 6 is moved so as to correct the positional displacement for imaging when a next electronic component D is taken out, and the suction nozzle 5 surely sucks the electronic component D.
申请公布号 JP2015211187(A) 申请公布日期 2015.11.24
申请号 JP20140093679 申请日期 2014.04.30
申请人 YAMAHA MOTOR CO LTD 发明人 KANAI OSAMU;KOMAIKE KUNIMUNE;KAMASUKA HIDEYUKI
分类号 H05K13/04;H05K13/02;H05K13/08 主分类号 H05K13/04
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