| 发明名称 |
Microelectronic Assembly including Built-In Thermoelectric Cooler and Method of Fabricating Same |
| 摘要 |
A method for fabricating a microelectronic assembly including a built-in TEC, a microelectronic assembly including a built-in TEC, and a system including the microelectronic assembly. The method includes providing a microelectronic device, and fabricating the TEC directly onto the microelectronic device such that there is no mounting material between the TEC and the microelectronic device. |
| 申请公布号 |
US2015332987(A1) |
申请公布日期 |
2015.11.19 |
| 申请号 |
US201314144179 |
申请日期 |
2013.12.30 |
| 申请人 |
Intel Corporation |
发明人 |
Farahani Mohammad M.;Chrysler Gregory;Frutschy Kris |
| 分类号 |
H01L23/38;H01L23/473;H01L35/32;H01L23/367;H01L25/16;H01L35/02 |
主分类号 |
H01L23/38 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A microelectronic assembly comprising:
a microelectronic device; and a thermoelectric cooler (TEC) coupled to the microelectronic device, wherein the TEC has a thickness range from 50 to 200 microns. |
| 地址 |
Santa Clara CA US |
