Encapsulation Layers with Improved Reliability

摘要

An electronic device may include a display having an array of organic light-emitting diodes formed on a substrate. An encapsulation layer may be formed over the array of organic light-emitting diodes to protect the organic light-emitting diodes from moisture and other contaminants. The encapsulation layer may include a transparent sheet of material interposed between upper and lower inorganic films. The reliability of the encapsulation layer is increased by dividing one or both of the inorganic films into multiple sub-layers. The sub-layers may have different densities and may be deposited in sequential steps. Additional moisture protection may be provided by forming a conformal thin-film coating over the organic light-emitting diodes. The conformal thin-film coating may be an aluminum oxide layer that is formed using atomic layer deposition techniques.

主权项

1. An encapsulation layer for encapsulating organic light-emitting diodes, comprising:
a first inorganic layer having multiple sub-layers; a second inorganic layer; and a transparent dielectric layer interposed between the first and second inorganic layers.