SUBSTRATE PROCESSING SYSTEM, SUBSTRATE PROCESSING METHOD, PROGRAM, AND COMPUTER STORAGE MEDIUM

摘要

PROBLEM TO BE SOLVED: To provide a substrate processing system which inhibits a coating liquid from being applied to an outer peripheral part of a substrate and properly performs substrate processing.SOLUTION: A substrate processing system supplies a hydrophobic agent H to an outer periphery part of a support wafer S from a hydrophobic agent nozzle while rotating the support wafer S held by a spin chuck. Then, the substrate processing system supplies an adhesive G to the support wafer S from an adhesive nozzle while relatively moving the support wafer S held by the holding part and the adhesive nozzle in a horizontal direction. At that time, the hydrophobic agent H prevents the adhesive G from being applied to the outer periphery part of the support wafer S. Further, a film thickness Tof the adhesive G on the support wafer S is larger than a film thickness Tof the hydrophobic agent H on the outer periphery part of the support wafer S.