THE PRINTED CIRCUIT BOARD AND THE METHOD FOR MANUFACTURING THE SAME

摘要

The present invention relates to a manufacturing method of a printed circuit board. The method comprises the following steps of: preparing an insulating substrate in which a metal layer is attached to one face of an insulating layer; forming a via-hole in the insulating layer to expose the metal layer; forming a lower layer by electroless plating on the other face of the insulating layer; forming an upper layer by embedding the via-hole by considering the lower layer as a seed; and forming a first circuit pattern by simultaneously etching the lower layer and the upper layer and forming a second circuit pattern by etching a copper foil layer. Accordingly, it is possible to keep thicknesses of the upper and lower circuit patterns uniform while forming a conductive via by plating at the time of forming a printed circuit board from a CCL. Therefore, it is possible to prevent a signal error caused by difference between thicknesses of circuit patterns at the time of transmitting a signal, thereby improving reliability.