Method and apparatus for laser cutting of transparent media

摘要

The invention relates to cutting of transparent materials (11) based on the use of radiation of an ultra-short pulse laser with two wavelengths and their temporal and/or spatial alignment. Proposed method comprises focusing of two pulsed beams ((IR, UV) of laser radiation with different wavelengths inside said transparent medium at different focal planes relative to depth of the processed transparent medium. The pulses of the laser radiation beams with different wavelengths arrive to their focal planes at different time moments, wherein the laser radiation pulses with the longer wavelength are delayed relative to the laser radiation pulses with the shorter wavelength. The cutting speed and quality are controlled by experimental preselecting of the pulse delay time, pulse energy ratio and spatial position of the focal planes relative to each other for said two pulsed beams of laser radiation with the different wavelengths