发明名称 保護カバーを備えたOLEDデバイス
摘要 The invention relates to an OLED device (1) comprising a light emitting layer stack (3) on top of a substrate (2) encapsulated by an encapsulating cover (4), where at least the edges of the substrate (2) and the encapsulating cover (4) are covered with a protection cover (5) made of a moldable material and to an OLED system (10) comprising at least one OLED device (1) and at least one electronic board (81, 82) connected to the at least one OLED device (1) by suitable connectors (85), preferably further comprising a cooling body (9) thermally connected to the OLED device (1). The invention further relates to a method to manufacture an OLED device (1) or an OLED system (10) comprising the step of applying a protection cover (5) to the OLED device (1) or the OLED system (10) by a plastic molding technique to at least partly cover the OLED device (1) or the OLED system (10).
申请公布号 JP5818796(B2) 申请公布日期 2015.11.18
申请号 JP20120528487 申请日期 2010.09.07
申请人 コーニンクレッカ フィリップス エヌ ヴェKONINKLIJKE PHILIPS N.V. 发明人 ファン モントフォルト,フィンセント イェー イェー;ミュンテルス,トム
分类号 H05B33/02;H01L51/50;H05B33/04;H05B33/06;H05B33/10 主分类号 H05B33/02
代理机构 代理人
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