| 摘要 |
The present invention provides a resin-sealed type semiconductor device capable of keeping the adhesive properties of sealing resin and improving the reliability and the like of the module. This resin-sealed type semiconductor device is a semiconductor device including: a conductive-patterned insulating substrate 1; conductive blocks 3a, 3b fixed to conductive patterns 2a, 2b of the conductive-patterned insulating substrate 1; a semiconductor chip 6 fixed to each conductive block; a printed circuit board 9 that has a conductive post 8 fixed to the semiconductor chip; and a resin 11 for sealing these constituents. The semiconductor device is configured such that the average volume of a conductive film per unit area of each conductive pattern around a section thereof, to which the corresponding conductive block is fixed, is reduced from the conductive block toward the outside. |
