发明名称 電子部品包装用積層シート及びその成形体
摘要 <p>The present invention discloses a laminated sheet for packaging electronic components comprising a front surface layer, a center core layer and a rear surface layer, wherein the front surface layer and the rear surface layer each contains a rubber-modified styrenic copolymer (A) having a graft ratio of grafted rubber of 30 to 50%, a grafted rubber particle diameter of 0.1 to 0.5μm and a butadiene content of 5 to 25% by weight, and polyetheresteramide (B), and the center core layer contains a rubber-modified styrenic copolymer (C) having a graft ratio of grafted rubber of 70 to 90%, a grafted rubber particle diameter of 0.4 to 1.0μm, and a butadiene content of 5 to 15% by weight, and 5 to 50% by weight of a recycled material of this laminated sheet.</p>
申请公布号 JP5814268(B2) 申请公布日期 2015.11.17
申请号 JP20120554811 申请日期 2012.01.25
申请人 发明人
分类号 B32B25/16;B65D85/38;C08L25/14;C08L51/04 主分类号 B32B25/16
代理机构 代理人
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