发明名称 Electrode coating for electron emission devices within cavities
摘要 Embodiments of a method for forming a field emission diode for an electrostatic discharge device include forming a first electrode, a sacrificial layer, and a second electrode. The sacrificial layer separates the first and second electrodes. The method further includes forming a cavity between the first and second electrode by removing the sacrificial layer. The cavity separates the first and second electrodes. The method further includes depositing an electron emission material on at least one of the first and second electrodes through at least one access hole after formation of the first and second electrodes. The access hole is located remotely from a location of electron emission on the first and second electrode.
申请公布号 US9190237(B1) 申请公布日期 2015.11.17
申请号 US201414261246 申请日期 2014.04.24
申请人 NXP B.V. 发明人 Reimann Klaus;Wunnicke Olaf;Zandt Michael in 't
分类号 H01J9/00;H01J9/12;H01J9/02;H01L27/02 主分类号 H01J9/00
代理机构 代理人
主权项 1. A method for forming a field emission diode for an electrostatic discharge device, the method comprising: forming a first electrode, a sacrificial layer, and a second electrode, wherein the sacrificial layer separates the first and second electrode; forming a cavity between the first and second electrode by removing the sacrificial layer, wherein the cavity separates the first and second electrodes; and depositing an electron emission material on a surface of at least one of the first and second electrodes through at least one access hole after formation of the first and second electrodes, wherein the access hole is located remotely from a location of electron emission on the first or second electrodes; plugging the access hole after depositing the electron emission material and forming a vacuum or low gas pressure in the cavity, wherein the cavity is hermetically sealed.
地址 Eindhoven NL