| 摘要 |
<p>1,112,463. Laminates. GENERAL ELECTRIC CO. 29 June, 1966 [12 July, 1965], No. 29281/66. Heading B5N. A laminate comprises a resin impregnated core stock and a surface layer comprising glass fibre paper impregnated with a resinous composition comprising by weight 70 parts of a phenolic resin modified epoxy resin, up to 50 parts of a thermoplastic condensation polymer of an epihalohydrin, and a polyhydric alcohol or polyhydric phenol, and from 0À1 part to 3 parts tertiary amine or a compound capable of liberating a tertiary amine upon heating. The core stock may be kraft or other paper or cellulosic, synthetic or organic materials either alone or in combination, and is for example fabric composed of glass, rayon, polyethylene terephthalate, acrylic, or asbestos fibres alone or in combination, e.g. eellulosic paper reinforced with glass fibres. The surface layer is a glass fibre paper, the fibres of which may be sized with silicones or chromium containing materials. The tertiary amine, which acts as a curing catalyst is of the formula R 3 N, where R is a monovalent hydrocarbon radical, e.g. an alkyl, aryl, aralkyl, alkenyl, cycloalkyl or cycloalkenyl radical and many examples of suitable amines are given. Alternatively, the term " tertiary amine" also includes amine derivatives, e.g. salts, and quaternary ammonium bases of amines. In one example, the core stock comprises six plies of fibre-reinforcedα- cellulose paper impregnated with a 50% solution of phenol-formaldehyde resin and dried in an oven. The surface layer is one ply of glass fibre paper impregnated with a solution comprising 70 parts phenolic modified epoxy resin, 30 parts of phenoxy resin which is a copolymer of bisphenol-A and epichlorohydrin, and 0À7 part of amine in a solvent. The solution is applied by dipping, brushing, or roller coating, and is dried by heat. The core and surface layers are assembled under heat and pressure which causes curing of the resins. The resulting laminate may be plated with a metal, e.g. copper, to produce a printed circuit board. The adhesion of the metal to the copper may be improved by heat treatment.</p> |
