METAL-CLAD LAMINATE, CIRCUIT BOARD AND POLYIMIDE

摘要

PROBLEM TO BE SOLVED: To provide a metal-clad laminate which can cope with requirements of high frequencies of electronic equipment by lowering the dielectric constant and is provided with an insulation resin layer having dielectric characteristics suppressed in temperature dependency, especially an insulation resin layer reduced in temperature dependence of the dielectric loss tangent and a circuit board.SOLUTION: A metal-clad laminate is provided with an insulation resin layer meeting conditions a) to c). Condition a): the Evalue, showing dielectric characteristics at 15 GHz after drying at 100°C for one h, is 0.007 or smaller. Condition b): in the Evalue showing dielectric characteristics at 15 GHz after 24-h humidity conditioning at 23°C and 50% RH, the ratio E/Elies in the range of 1.0-2.0. Condition c): the thermal expansion coefficient lies in the range of 10-30 ppm K.