LEAD FRAME WITH RESIN AND MANUFACTURING METHOD OF LEAD FRAME WITH RESIN AND LED PACKAGE AND MANUFACTURING METHOD OF LED PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide a lead frame with a resin which prevents voids from occurring in solder on a rear surface of an LED package and a manufacturing method of the lead frame with the resin, and to provide an LED package and a manufacturing method of the LED package.SOLUTION: A lead frame 30 with a resin includes: a lead frame 10 having a die pad 25 and a lead part 26 which is provided spaced away from the die pad 25; and reflection resins 23 which are provided enclosing peripheries of the die pad 25 and the lead part 26 and is integrated with the lead frame 10. Outer lead parts 27, 28 are respectively formed in the die pad 25 and the lead part 26. Multiple protrusions 47 are formed on a surface side of each reflection resin 23 on which the outer lead parts 27, 28 of the lead frame 10 are formed.