| 摘要 |
PROBLEM TO BE SOLVED: To improve the processing efficiency of a substrate in the case of executing the test of a polishing part or a cleaning part.SOLUTION: A CMP device includes: a polishing unit 3 including at least one polishing part for polishing a substrate; a cleaning unit 4 including at least one cleaning part for cleaning the substrate; a load/unload unit 2; a conveyance unit for conveying the substrate among the polishing unit 3, the cleaning unit 4 and the load/unload unit 2; and a control part 5 for controlling the conveyance of the substrate by the conveyance unit. The control part 5 is configured to, when the polishing unit includes a plurality of polishing parts or the cleaning unit includes a plurality of cleaning parts, set a test mode for allowing the polishing part or the cleaning part to operate for a test in a part of the plurality of polishing parts or a part of the plurality of cleaning parts, and to control the conveyance unit to convey the substrate to the polishing part or the cleaning part in which the test mode is not set, and to convey a substrate for a test different from the substrate to the polishing part or the cleaning part in which the test mode is set. |
