SUBSTRATE WITH A LOW DIELECTRIC CONSTANT MATERIAL AND METHOD OF MOLDING

摘要

Connectors (600) and/or substrates which are made utilizing a low dielectric constant injection moldable polymer or other melt proces sable polymer, such as, but not limited to, thermoplastic material, thermoplastic composite material, thermoset material, thermoset composite material or a combination thereof. The low dielectric constant injection moldable polymer or other melt processable polymer supports noise and/or crosstalk reductions for high speed signal transmission. The low dielectric constant material provides dielectric shielding between adjacent high speed signal lines (602). The reduced dielectric constant and reduced loss-tangent is created by forming voids or pores (10) within the bulk plastic material, thus increasing the air, gas or void content, and thus decreasing the density and overall dielectric constant of such material. The porosity thus introduced into the shielding between adjacent transmission lines reduces crosstalk and other losses, and thus maintains signal integrity in connector/substrate designs.