CONDUCTIVE CONNECTIONS, STRUCTURES WITH SUCH CONNECTIONS, AND METHODS OF MANUFACTURE

摘要

In some embodiments, to increase the height-to-pitch ratio of a solder connection that connects different structures with one or more solder balls, only a portion of a solder ball's surface is melted when the connection is formed on one structure and/or when the connection is being attached to another structure. In some embodiments, non-solder balls are joined by an intermediate solder ball (140i). A solder connection may be surrounded by a solder locking layer (1210) and may be recessed in a hole (1230) in that layer. Other features are also provided.

主权项

1. A method for attaching a first conductive component to a second conductive component, the method comprising:
(1) melting a first portion of a surface of the first conductive component without melting a second portion of the surface of the first conductive component even though the second portion's melting temperature is no higher than the first portion's melting temperature, wherein the second portion is continuous with the first portion; (2) bringing the melted first portion into physical contact with the second conductive component and cooling the first portion to form a conductive attachment between the first and second conductive components.