| 发明名称 |
Method of singularizing packages and leadframe |
| 摘要 |
A method of singularizing a matrix array of packages is provided, wherein the method comprises providing a matrix array of packages, wherein the matrix array is formed on a leadframe; cutting predefined leads of the leadframe by a punching process; and singularizing the packages of the matrix array of packages by a sawing process. |
| 申请公布号 |
US2015325503(A1) |
申请公布日期 |
2015.11.12 |
| 申请号 |
US201414272568 |
申请日期 |
2014.05.08 |
| 申请人 |
Infineon Technologies AG |
发明人 |
LAY YEAP Lim;Nee Wan Khoo;Thiong Zhou See |
| 分类号 |
H01L23/495;H01L23/31;H01L21/78 |
主分类号 |
H01L23/495 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of singularizing a matrix array of packages, the method comprising:
providing a matrix array of packages, wherein the matrix array is formed on a leadframe, cutting predefined leads of the leadframe by a punching process; and singularizing the packages of the matrix array of packages by a sawing process. |
| 地址 |
Neubiberg DE |
