HEAT MANAGEMENT FOR ELECTRONIC ENCLOSURES

摘要

An enclosure and method for housing electrical components. The enclosure includes walls provided about the electrical components, the walls having poor thermal conductivity. At least one thermal transport device extends through at least one respective wall. The at least one thermal transport device has a first portion which is positioned within the enclosure, a second portion which is positioned outside of the enclosure and a transition portion which connects the first portion to the second portion. The at least one thermal transport device has a high effective thermal conductivity and provides a high thermal conductivity path for heat energy to pass from within the enclosure to outside the enclosure.

主权项

1. An enclosure for housing electrical components, the enclosure comprising:
walls provided about the electrical components, the walls having poor thermal conductivity; at least one thermal transport device extending through at least one respective wall, the at least one thermal transport device having a first portion which is positioned within the enclosure, a second portion which is positioned outside of the enclosure and a transition portion which connects the first portion to the second portion; wherein the at least one thermal transport device has a high effective thermal conductivity and provides a high thermal conductivity path for heat energy to pass from within the enclosure to outside the enclosure.