| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board having less warpage.SOLUTION: A printed wiring board according to an embodiment has: a core substrate which has an insulating substrate having a first surface and a second surface, and a through hole conductor formed in a through hole which pierces the insulating substrate and has a joint surface; upper resin insulation layers formed on the first surface of the insulating substrate; and lower resin insulation layers formed on the second surface of he insulating substrate. The number of upper resin insulation layers is larger than the number of lower resin insulation layers. All bonded surfaces are not included in one plane parallel with the first surface. |
