Light-emitting device and method for fabricating the same

摘要

To provide a method for fabricating a light-emitting device using flexible glass which is capable of withstanding a process temperature higher than or equal to 500° C., and the light-emitting device. A second substrate is attached to a support substrate using an adsorption layer. The second substrate is bonded to a backplane substrate provided with a transistor and a light-emitting element. The backplane substrate includes a separation layer and a buffer layer. A first substrate is separated from the backplane substrate by separation between the separation layer and the buffer layer. A flexible third substrate is bonded, using a second adhesive layer, to a surface of the buffer layer exposed by the separation. The support substrate is separated from the second substrate by separation between the second substrate and the adsorption layer.

主权项

1. A method for fabricating a light-emitting device, comprising:
a first step in which a backplane substrate is fabricated by forming a separation layer over a first substrate, forming a buffer layer over the separation layer, forming a plurality of transistors over the buffer layer, forming an insulating layer over the plurality of transistors, and forming a light-emitting element electrically connected to one of the plurality of transistors; a second step in which an adsorption layer is formed over a support substrate and a second substrate with a thickness greater than or equal to 10 μm and less than or equal to 500 μm is formed in contact with the adsorption layer; a third step in which the second substrate is coated with a first adhesive layer and the second substrate is bonded, using the first adhesive layer, to a surface of the backplane substrate over which the light-emitting element is formed; a fourth step in which the first substrate is separated from the backplane substrate by separation between the separation layer and the buffer layer and a third substrate is bonded, using a second adhesive layer, to a surface of the buffer layer exposed by the separation; and a fifth step in which the support substrate is separated from the second substrate by separation between the second substrate and the adsorption layer, wherein the third step is performed after the first step and the second step, and then, the fourth step and the fifth step are performed.