发明名称 |
Method of manufacturing a sensor for sensing analytes |
摘要 |
A method of manufacturing a sensor for sensing analytes, the method including: with a dicing saw, removing material from a substrate, thereby forming an array of columnar protrusions at a first surface of the substrate; forming an insulating layer coupled to exposed surfaces of the substrate and exposed surfaces of the array of columnar protrusions; removing a portion of the insulating layer at a second surface of the substrate, directly opposed to the first surface of the substrate; with the dicing saw, removing material from a distal end of each columnar protrusion in the array of columnar protrusions, thereby defining a sharp tip, uncovered by the insulating layer, at the distal end of each columnar protrusion in the array of columnar protrusions; and coupling a conductive layer to the sharp tip of each columnar protrusion in the array of columnar protrusions. |
申请公布号 |
US9182368(B2) |
申请公布日期 |
2015.11.10 |
申请号 |
US201414211404 |
申请日期 |
2014.03.14 |
申请人 |
Sano Intelligence, Inc. |
发明人 |
Pushpala Ashwin;Szmodis Alan;Chapman Matthew;Hall Weldon;Miller Scott;Hafezi Hooman |
分类号 |
A61B5/145;A61B5/1486;G01N27/327;A61B5/00;A61M25/00 |
主分类号 |
A61B5/145 |
代理机构 |
|
代理人 |
Schox Jeffrey;Wong Ivan |
主权项 |
1. A method of manufacturing a sensor for sensing analytes, the method comprising:
with a dicing saw, removing material from a substrate, thereby forming an array of columnar protrusions at a first surface of the substrate; forming an insulating layer coupled to exposed surfaces of the substrate and exposed surfaces of the array of columnar protrusions; removing a portion of the insulating layer at a second surface of the substrate, directly opposed to the first surface of the substrate; with the dicing saw, removing material from a distal end of each columnar protrusion in the array of columnar protrusions, thereby defining a sharp tip, uncovered by the insulating layer, at the distal end of each columnar protrusion in the array of columnar protrusions; and coupling a conductive layer to the sharp tip of each columnar protrusion in the array of columnar protrusions. |
地址 |
San Francisco CA US |