METHOD OF FABRICATING SEMICONDUCTOR PACKAGE, THE SEMICONDUCTOR PACKAGE FORMED THEREBY, AND SEMICONDUCTOR DEVICE COMPRISING THE SAME

摘要

A semiconductor package according to the embodiment of the present invention includes a semiconductor chip which is stacked on a substrate, an underfill resin layer which is filled between the semiconductor chip and the substrate and covers the side of the semiconductor chip, and a molding layer which covers the underfill resin layer and the side of the substrate. The present invention improves the reliability of the semiconductor package.