Polishing pad, manufacturing method therefor, and method for manufacturing a semiconductor device

摘要

A polishing pad having a polishing layer comprising a thermoset polyurethane foam, wherein the thermoset polyurethane foam contains, as raw material components, an isocyanate component, and active-hydrogen-containing compounds, and the active-hydrogen-containing compounds comprise one or more polyol compounds (each) having two or more functional groups, and a monool compound having one functional group.

主权项

1. A polishing pad having a polishing layer comprising a thermoset polyurethane foam,
wherein the thermoset polyurethane foam contains, as raw material components, an isocyanate component, and active-hydrogen-containing compounds, and the active-hydrogen-containing compounds comprise one or more polyol compounds, each of which has two or more functional groups, and a monool compound having one functional group, and the monool compound is a compound represented by the following general formula (1):
R1-(OCH2CHR2)n-OH  (1) wherein R1 is a methyl or ethyl group, R2 is a hydrogen atom, or a methyl group, and n is an integer of 1 or 2, and the thermoset polyurethane foam has substantially spherical bubbles having an average bubble diameter of 20 to 300 μm.