| 发明名称 |
Nonleaded package and leadframe strip and method |
| 摘要 |
A nonleaded IC package, such as a QFN, including an encapsulation block having at least one generally flat lateral sidewall surface; and a plurality of leads, each terminating in a generally chair-shaped flat surface that is flush with the generally flat lateral sidewall surface. |
| 申请公布号 |
US9184120(B1) |
申请公布日期 |
2015.11.10 |
| 申请号 |
US201414454203 |
申请日期 |
2014.08.07 |
| 申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
Babaran Dolores Parobrob;Pinlac Mark Gerald Rosario;Viluan Ramil Alfonso |
| 分类号 |
H01L23/495;H01L23/28;H01L21/78;H01L21/48;H01L21/56 |
主分类号 |
H01L23/495 |
| 代理机构 |
|
代理人 |
Shaw Steven A.;Brill Charles A.;Cimino Frank D. |
| 主权项 |
1. A nonleaded IC package, such as a QFN, comprising:
an encapsulation block having at least one generally flat lateral sidewall surface; and a plurality of leads, each terminating in a generally chair-shaped flat surface that is flush with said lateral sidewall. |
| 地址 |
Dallas TX US |
