| 摘要 |
The present invention relates to a substrate processing apparatus which includes a cleaning unit which cleans a discharge head on which discharge holes are formed to discharge a solution to a substrate. According to one embodiment of the present invention, the substrate processing apparatus comprises: a support member which supports a substrate; the discharge head which discharges the solution to the support member, having a longitudinal direction be arranged along a first detection; and the cleaning unit which cleans the discharge head. The cleaning unit includes a body which includes a slit to provide a vacuum on an upper side thereof, having the longitudinal direction provided along the first direction. The slit is inclined in the first direction in view of the upper side. According to the present invention, the efficiency of a cleaning process is improved by efficiently removing the solutions which remain on the discharge head. |
