| 发明名称 |
Composite Contact Plug Structure and Method of Making Same |
| 摘要 |
An embodiment contact plug includes a bilayer structure and a diffusion barrier layer on a sidewall and a bottom surface of the bilayer structure. The bilayer structure includes a conductive core and a conductive liner on a sidewall and a bottom surface of the conductive core. In the embodiment contact plug, the conductive liner comprises cobalt or ruthenium. |
| 申请公布号 |
US2015318243(A1) |
申请公布日期 |
2015.11.05 |
| 申请号 |
US201414313111 |
申请日期 |
2014.06.24 |
| 申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Lin Yu-Hung;Lin Sheng-Hsuan;Chang Chih-Wei;Chou You-Hua;Hsu Chia-Lin |
| 分类号 |
H01L23/522;H01L21/768;H01L23/532 |
主分类号 |
H01L23/522 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A contact plug comprising:
a bilayer structure comprising:
a conductive core; anda conductive liner on a sidewall and a bottom surface of the conductive core, wherein the conductive liner comprises cobalt or ruthenium; and a diffusion barrier layer on a sidewall and a bottom surface of the bilayer structure. |
| 地址 |
Hsin-Chu TW |
