| 摘要 |
PROBLEM TO BE SOLVED: To provide a chemical mechanical polishing device which performs mirror polishing to a workpiece having a surface shape formed by a combination of a flat surface and a curved surface.SOLUTION: A chemical mechanical polishing device includes: a rotary polishing table 4 for supporting a polishing pad 3; a carrier 1 which presses the workpiece W to the polishing pad 3; a rotary mechanism 2 which rotates the carrier 1 around an axial center; and a polishing liquid supply mechanism 5 which supplies a polishing liquid onto the polishing pad 3. The carrier 1 includes: a workpiece holding part 9 which holds the workpiece W; a rotary actuator 130 wich rotates the workpiece W held by the workpiece holding part 9 around a center axis at a preset speed; and a vertical movement mechanism 135 which vertically moves the workpiece W synchronously with rotation of the workpiece W. |
