Housing for an optoelectronic semiconductor component and method for producing such a housing

摘要

A housing for an optoelectronic semiconductor component includes a housing body having a mounting plane and a leadframe with a first connection conductor and a second connection conductor. The housing body deforms the leadframe in some regions. The leadframe has a main extension plane which extends obliquely or perpendicularly with respect to the mounting plane. A semiconductor component having such a housing and a semiconductor chip and a method for producing a housing are also disclosed.

主权项

1. A housing for an optoelectronic semiconductor component, wherein the optoelectronic semiconductor component is configured to emit radiation, the housing comprising:
a leadframe having a first connection conductor and a second connection conductor; and a housing body having a mounting plane, wherein the housing body molds around the leadframe in regions, wherein the housing body is non-transmissive to the radiation, wherein the leadframe has a main extension plane running obliquely or perpendicularly with respect to the mounting plane, and wherein a region of the first connection conductor which projects from the housing body in a direction running along the mounting plane is configured to be an external electrical contact region of the housing.